Meyer Burger-Pierre PAPET

Towards a 25% ultra wide pitch IBC HJT solar cell in 10 process steps. P.PAPET, D.LACHENAL, B.LEGRADIC, T.KOSSLER, D.BAETZNER, W.FRAMMELSBERGER, N.HOLM, R.KRAMER, L.ANDREETTA, B.STRAHM 1 Meyer Burger Research, Switzerland Contact : pierre.papet@meyerburger.com Me ye r B urg er / 19 -05 -15 2  European Next-Base project  Tunnel IBC-junction architecture and process flow  24.8% Solar cell - Series Resistance analysis  SWCT IBC module concept & performances  Latest efficiency progresses at Meyer Burger Research  Conclusions Outline Me ye r B urg er / 19 -05 -15 Next-Base IBC HJT European project  Meyer Burger Research is part of the H2020 Next-Base project together with many European partners involved: • 26% efficiency target • New industrial manufacturing tool • low-cost processes 2000 interconnections cell/wire, low sensibility to cell cracks, Pb free solution… Me ye r B urg er / 19 -05 -15 17 IBC SWCT module status One cell module Record module reaches 23.2% efficiency (based on 90.2cm2 active area)  Based on 23.9% IBC cell  CTM of -2.7%  Target 2% with full wafer  First modules with 4 and 16 cells configurations Me ye r B urg er / 19 -05 -15 18 IBC SWCT module reliability Thermo-cycling (from -40°C to +85°C) after 200cycles Damp-Heat (85%RH&85°C) after 1200h  Good reliability Initial EL After 1200H DH Me ye r B urg er / 19 -05 -15 19 Latest efficiency progresses  90.2cm2 IBC cell  M2 IBC cell (244.2cm2)  Ramp-up phase (200 produced) Area = 244.2cm2 Jsc =40.4cm2 Voc =740mV FF = 77.7% Eff. = 23.2%  Process transfer from monofacial to bifacial IBC Exclusively based on commercial CZ N-type wafers Me ye r B urg er / 19 -05 -15 20  Rs analysis highlights – Large freedom on N/P feature sizes. – The emitter contact/TCO is the main Rs contributor  IBC-HJT tunnel : Simple processing scheme – Only one localized layer & screen printing alignments  Best performing single junction device: – High Voc & FF thanks to passivated contacts – 25% efficiency reached on 92cm2  Reduced material costs – Indium & lead free – Compatible with Ag Screen printing thanks to SmartWire interconnection  High module performances – Low cell to module (CTM) losses – 23.2% module efficiency on 92cm2 – 80% bifaciality soon Conclusions Thanks for your attention Acknowledgements : This works is supported by H2020 Next-base Project CSEM team support 21