硅片PL自动分选机简介_20110803

3SystemsPL2011.3PL-B56 3i SystemsConfidential3isystems 2PL B56PECVD3200(L)x 1300(W)PL IRPL,>50um> 1500 /3i SystemsConfidential3isystems 3>64PL IR800(L)x 800(W) 600(L) x 600(W)>50um>300um> 1500 / > 1500 /3i SystemsConfidential3isystems 4Item Specificationlity Productivity 1500 pcs/hToolStabiHardware stability in production Wafer breakage rate 98%Stability MTBF /(MTBF + MTTR) > 95%alityImage acquisition Image qualityImage capture time 98.5%Black edgeC kAc CrackafetyAlarm system Light and soundSystem protection for operation errors S/W & H/W protections3i SystemsConfidential3isystems 5SSystem recovery No data losePL900pixel60%>60% 900pixel3i SystemsConfidential3isystems 6A.53.9% 54.5%>900pixel56.9% 53.9%p40%~60%3i SystemsConfidential3isystems 7B. 60.5% 60.6%>900pixel60.9% 60.9%p60%3i SystemsConfidential3isystems 8C. PLwafer3i SystemsConfidential3isystems 9Bare wafer PL IR3Eff Voc Isc wafer1 0.1579 0.00185 0.6122 0.00172 7.976 0.04109 582 40%~60% 0.1607 0.0026 0.6135 0.00385 8.072 0.07943 1223 >60% 0.1622 0.00281 0.6146 0.0041 8.126 0.08222 883i SystemsConfidential3isystems 103i 3i PL&EL(Photon International2010 1)3i3i PLPL3i3i SystemsConfidential3isystems3i SystemsConfidential3isystems 12