硅片加工损伤机理的压痕、划痕研究

硅片加工损伤机理的压痕、划痕研究作者： 郜伟 ， 张银霞 ， Gao Wei， Zheng Yin-xia作者单位： 郑州大学机械工程学院 ,河南郑州 ,450001刊名： 电子质量英文刊名： ELECTRONICS QUALITY年，卷 (期 )： 2008(8)参考文献 (17条)1. Vodenitcharova T;Zhang L C A mechanics prediction of the behaviour of monocrystalline sillconunder nano-indentation [外文期刊 ] 2003(12)2. Puttick K E;Whitmore L C;Zhdan P Energy scaling transitions in machning of silicon by diamond [外文期刊 ] 1995(06)3. Jardret V;Zahouani H;Loubet J L Understanding and quantification of elastic and plasticdeformation during a scratch test [外文期刊 ] 1998(1)4. 张琼 ;周海芳 ;李斗星 室温下单晶硅压痕微裂纹的形成与扩展 [期刊论文] -电子显微学报 2002(01)5. 罗熙淳 ;梁迎春 ;董申 单晶硅纳米加工机理的分子动力学研究 [期刊论文] -航空精密制造技术 2000(03)6. 林滨 ;韩雪松 ;于思远 纳米磨削过程中分子动力学计算机仿真实验 [期刊论文] -天津大学学报 2000(05)7. Zhao X Z;Bhushan B Material removal mechanisms of single-crystal silicon on nanoscale and atultralow loads [外文期刊 ] 1998(1/2)8. Pizani P S;Jasinevicius R Ductile and brittle modes in single-point-diamond-turning of siliconprobed by Raman scattering [外文期刊 ] 19999. Gogotsi Y;ZhouG;Ku S S Raman microspectroscopy analysis of pressure-induced metallization inscratching of silicon [外文期刊 ] 2001(5)10. Kailer A;Gogotsi Y;Nickel K G Phase transformations of silicon caused by contact loading [外文期刊] 1997(7)11. 蔡传荣 ;张琼 单晶硅硬度压痕裂纹的特征 [期刊论文] -电子显微学报 1996(06)12. 李东升 集成电路用直拉硅单晶力学性能 [学位论文 ] 200113. Zarudi I;Zhang L C Structure changes in monocrystalline silicon subjecced to indentation-experimental findings [外文期刊 ] 1999(12)14. Zhang L C;Zarudi I Towards a deeper understanding of plastic deformation in monocrystallinesilicon [外文期刊 ] 2001(9)15. Bismayer U;Brinksmeier E;Guttler B Measurement of subsurface damage in silicon wafers 1994(02)16. Pei Z J A smay on surface grinding of 300 mm silicon wafers [外文期刊 ] 2002(3)17. Tomhoff H K;Schmieden W V;Inasaki I Abrasive machining of silicon [外文期刊 ] 1990(02)本文链接： http://d.g.wanfangdata.com.cn/Periodical_dzzl200808017.aspx