Application of low-destructive Cutting Technology on Halfcut and Shingled Modules-Gsolar

Application of low-destructive Cutting Technology on Halfcut and Shingled Modules Gsolar Power Co.,Ltd Han han 1. Cutting Technology 2. Cutting Result 3. Application of Cutting Technology Theory Thermal Laser Separation Laser heating Non-uniform thermal field Thermal stress Crack propagation Laser Crack propagation direction Application range of thermal stress cutting Brittle material - elongation below５ ％ wafer, ceramics, glass Obtuse angel Thin wafer The key of thermal stress cutting Thermal gradient –laser heating, water cooling, air cooling Crack guide Initial crack, surface crack Gsola technology characteristics laser directly split it into several pieces； No need for air cooling / water cooling ； Deeper cutting depth ； Faster cutting speed ； loading/positioning slicing unloading 1. Cutting Technology 2. Cutting Result 3. Application of Cutting Technology Grooving appearance comparison Gsola mono Gsola multi Competitors multi  Gsola technology characteristics  The grooved laser adopts a three-layer focusing lens combined with an imported IPG fiber laser. The spot diameter is about μm, and the groove heat affected area is small;  In the conventional grooving process, the groove depth is required to be about 50 of the total thickness of the cell. Gsolas special splitting process allows the groove depth to be reduced. The depth of the multi-si cell is about 30-40 of the total thickness, and the depth of the mono-si cell is about 0 of the total thickness. Competitor slice result analysis Groove width of 34 μm, heat affected zone of 143 μm The groove depth is 110 μm, about 50 of thickness of the cell, and there are more shadow areas due to surface roughness. Gsola multi-si slice analysis Groove width of 28μm, heat affected zone of 100μm The groove depth is 90 μm, and the surface roughness is slightly lowered. Gsola mono-si slice analysis- split position with Al-BSF Groove width of 22μm, heat affected zone of 56μm The groove depth is 35-45μm, about 18 -23 of thickness of the cell Gsola mono-si slice analysis- split position without Al-BSF Groove width of 6μm, heat affected zone of 37μm The groove depth is less than 15μm, less than 10 of thickness of the cell 1. Cutting Technology 2. Cutting Result 3. Application of Cutting Technology Technical Parameters Cutting accuracy 50μm； Throughput 2600pcs/h； Cell size 156.75mm0.25mm, cell thickness 140μm-200μm； Equipment structure GDS 26 is an off-line structure, the loading and unloading of cells are carried by a cartridge. Put the cartridge with whole cells from the left side ； Automatic accurate slice ； The cut half-cell is placed in another cartridge ； The cartridge is sent from the right side 。 dimension of the equipment Length 2500mm, Width 1200mm, height 2100mm 。 The horizontal reserved space is about 1m, and the vertical reserved space is about 0.6m. 。 Process flow loading/unloading cell boxes each one have a track ； There are 3 cell transfer steps . Test photographing/aligning, slicing, unloading 。 In the actual working process, the cell in the loading box is sequentially placed into the positioning station to detect the appearance and test the size of the cell by the loading robot. 。 Through the transporting fork into the slicing step, then the slicing robot is used to drive the lasers 1 and 2 to realize the splitting of the solar cell. The solar cell is transferred to the unloading step through the transporting fork, and then the cell is placed in the unloading material box by the unloading robot. Process flow transporting fork Detection/positioning cutting uploading Laser spot moving direction Thank you