蒋建龙《COMPANY & SOLAR INTRODUCTION》

COMPANY compact machine concept OPEX low machine consumable cost ; jigless concept Plating thickness uniformity within cell and cell-to-cell Capability to integrate resist stripping and etch back processes in one tool CPL Solar Meco’s competitive edge for HJT IBC CONFIDENTIAL 0.5 mm Minor clip mark on IBC cell Meco Solar Plated HJT cells adhesion and lifetime data CONFIDENTIAL Source CSEM, EUPVSEC 2018 lifetime dataPeel strength data Source CSEM, EUPVSEC 2018 CONFIDENTIAL Meco Solar Bifacial heterojunction cell plating CoO model Total plating cost 1.20 USc/Wp Total metallization cost - Cu PVD process -Resist deposition/Plating -Resist stripping etch back 3.65 USc/Wp Bifacial printing of low Temperature Ag paste 6.1 USc/Wp Cost ∆ 2.45 USc/Wp