硅片加工损伤机理的压痕、划痕研究

硅片加工损伤机理的压痕、划痕研究作者 郜伟 ， 张银霞 ， Gao Wei， Zheng Yin-xia作者单位 郑州大学机械工程学院 ,河南郑州 ,450001刊名 电子质量英文刊名 ELECTRONICS QUALITY年，卷 期 20088参考文献 17条1. Vodenitcharova T;Zhang L C A mechanics prediction of the behaviour of monocrystalline sillconunder nano-indentation [外文期刊 ] 2003122. Puttick K E;Whitmore L C;Zhdan P Energy scaling transitions in machning of silicon by diamond [外文期刊 ] 1995063. Jardret V;Zahouani H;Loubet J L Understanding and quantification of elastic and plasticdeformation during a scratch test [外文期刊 ] 199814. 张琼 ;周海芳 ;李斗星 室温下单晶硅压痕微裂纹的形成与扩展 [期刊论文] -电子显微学报 2002015. 罗熙淳 ;梁迎春 ;董申 单晶硅纳米加工机理的分子动力学研究 [期刊论文] -航空精密制造技术 2000036. 林滨 ;韩雪松 ;于思远 纳米磨削过程中分子动力学计算机仿真实验 [期刊论文] -天津大学学报 2000057. Zhao X Z;Bhushan B Material removal mechanisms of single-crystal silicon on nanoscale and atultralow loads [外文期刊 ] 19981/28. Pizani P S;Jasinevicius R Ductile and brittle modes in single-point-diamond-turning of siliconprobed by Raman scattering [外文期刊 ] 19999. Gogotsi Y;ZhouG;Ku S S Raman microspectroscopy analysis of pressure-induced metallization inscratching of silicon [外文期刊 ] 2001510. Kailer A;Gogotsi Y;Nickel K G Phase transformations of silicon caused by contact loading [外文期刊] 1997711. 蔡传荣 ;张琼 单晶硅硬度压痕裂纹的特征 [期刊论文] -电子显微学报 19960612. 李东升 集成电路用直拉硅单晶力学性能 [学位论文 ] 200113. Zarudi I;Zhang L C Structure changes in monocrystalline silicon subjecced to indentation-experimental findings [外文期刊 ] 19991214. Zhang L C;Zarudi I Towards a deeper understanding of plastic deformation in monocrystallinesilicon [外文期刊 ] 2001915. Bismayer U;Brinksmeier E;Guttler B Measurement of subsurface damage in silicon wafers 19940216. Pei Z J A smay on surface grinding of 300 mm silicon wafers [外文期刊 ] 2002317. Tomhoff H K;Schmieden W V;Inasaki I Abrasive machining of silicon [外文期刊 ] 199002本文链接 http//d.g.wanfangdata.com.cn/Periodical_dzzl200808017.aspx