Meyer Burger-Pierre PAPET

Towards a 25 ultra wide pitch IBC HJT solar cell in 10 process steps. P.PAPET, D.LACHENAL, B.LEGRADIC, T.KOSSLER, D.BAETZNER, W.FRAMMELSBERGER, N.HOLM, R.KRAMER, L.ANDREETTA, B.STRAHM 1 Meyer Burger Research, Switzerland Contact pierre.papetmeyerburger.com Me ye r B urg er / 19 -05 -15 2  European Next-Base project  Tunnel IBC-junction architecture and process flow  24.8 Solar cell - Series Resistance analysis  SWCT IBC module concept performances  Latest efficiency progresses at Meyer Burger Research  Conclusions Outline Me ye r B urg er / 19 -05 -15 Next-Base IBC HJT European project  Meyer Burger Research is part of the H2020 Next-Base project together with many European partners involved 26 efficiency target New industrial manufacturing tool low-cost processes 2000 interconnections cell/wire, low sensibility to cell cracks, Pb free solution Me ye r B urg er / 19 -05 -15 17 IBC SWCT module status One cell module Record module reaches 23.2 efficiency based on 90.2cm2 active area  Based on 23.9 IBC cell  CTM of -2.7  Target 2 with full wafer  First modules with 4 and 16 cells configurations Me ye r B urg er / 19 -05 -15 18 IBC SWCT module reliability Thermo-cycling from -40C to 85C after 200cycles Damp-Heat 85RH85C after 1200h  Good reliability Initial EL After 1200H DH Me ye r B urg er / 19 -05 -15 19 Latest efficiency progresses  90.2cm2 IBC cell  M2 IBC cell 244.2cm2  Ramp-up phase 200 produced Area 244.2cm2 Jsc 40.4cm2 Voc 740mV FF 77.7 Eff. 23.2  Process transfer from monofacial to bifacial IBC Exclusively based on commercial CZ N-type wafers Me ye r B urg er / 19 -05 -15 20  Rs analysis highlights – Large freedom on N/P feature sizes. – The emitter contact/TCO is the main Rs contributor  IBC-HJT tunnel Simple processing scheme – Only one localized layer screen printing alignments  Best performing single junction device – High Voc FF thanks to passivated contacts – 25 efficiency reached on 92cm2  Reduced material costs – Indium lead free – Compatible with Ag Screen printing thanks to SmartWire interconnection  High module performances – Low cell to module CTM losses – 23.2 module efficiency on 92cm2 – 80 bifaciality soon Conclusions Thanks for your attention Acknowledgements This works is supported by H2020 Next-base Project CSEM team support 21